Objective and Areas of Interest
You are cordially invited to participate in the 3rd International Conference on Ambient Intelligence and Ergonomics in Asia. The conference objective is to provide an international forum for the dissemination and exchange of scientific information on theoretical, generic, and applied areas of ambient intelligence and ergonomics, including their theories and applications in safety, healthcare, digital human modeling, affective and pleasurable design, advanced manufacturing system, future product design, and service engineering.
You are invited to submit your work in areas of:
- Ambient intelligence systems
- Cost and effect analysis of ambient intelligence applications
- Data analysis in ambient intelligence
- Digital human modeling
- Domestic care of the elderly, Assisted living (ambient intelligence applications)
- Health care (ambient intelligence applications)
- Human factors in ambient intelligence
- Human system interface
- Interdisciplinary aggregation architecture of ambient intelligence
- Mobile commerce
- Occupational psychology applications in ambient intelligence
- RFID applications
- Smart factory, ambient intelligence in industry (ambient intelligence applications)
- Smart home, ambient intelligence at home (ambient intelligence applications)
- Smart shops, shopping, recommender system, business (ambient intelligence applications)
- Systematic procedure for designing, analyzing, and implementing ambient intelligence applications
- Virtual museum, tour (ambient intelligence applications)
- Virtual product design, affective and pleasurable design (ambient intelligence applications)
- Others
Time Schedule & Deadline (New)
Submission abstracts (for oral or poster presentation) November 30, 2016
Reviewer remarks January 20, 2017
Early bird registration March 15, 2017
Receiving full papers or revised abstracts
Regular registration for any submissions*
April 15, 2017
Regular registration for participants without a submission August 23, 2017
*Each abstract must be registered by at least one author before April 15, 2017
To submit an abstract: http://www.amie-tw.org/amie2017/submission.html
All submitted abstracts will be peer-reviewed by two independent referees from the international program boards. It is anticipated that a broad range of research and applied topics will be covered during the conference. Good abstracts will be selected and be asked to provide full paper for further consideration of publication in the special issues of international journals which are indexed by EI, SCI or SSCI.
Special Issues
- Journal of Ambient Intelligence and Humanized Computing, Special Issue: AmI&E 2017 (EI, SCI)
Papers selected to participate to this special issue have to submit the paper via official Journal website, at the link http://www.editorialmanager.com/aihc
- Rapid Prototyping Journal Special Issue on "Managing 3D Printing Technologies for Manufacturing" (SCI)
Papers selected to participate to this special issue have to submit the paper via official Journal website, at the link http://mc.manuscriptcentral.com/rpj
- Applied Spatial Analysis and Policy, special issue on "Sustainable Location-aware Services" (SSCI, SCI)
Best regards,
AmI&E 2017 Organizing Committee
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